| Overall composition |
- Primer with solvent-free, transparent 2K epoxy resin
- 2K-EP plaster filled with hard stones
- Surface treatment using solvent-free, transparent,
low yellow 2K epoxy resin putty
- Final treatment using machine grinding in multiple
operating stages |
| Installation thickness |
10 to 20 mm |
| Weight of the surface |
approx. 30 kg with an installation thickness of 15 mm |
| Strengths |
- Compressive strength at prisms: approx. 80 N/mm²
- Bending tensile strength at prisms: approx. 24 N/mm²
- Flexural deformation module: approx. 11.000 N/mm² |
| Boehme’s abrasion resistance |
4,6 cm³/50 cm² |
| Fire performance |
Flame-retardant in accordance with DIN EN 13501-1 =
Bfl.-s-1 |
Longitudinal coefficient of
expansion a T |
10 °C to 30 °C = 1.41 * 10-5 /K
30 °C to 50 °C = 4.04 * 10-5 /K |
| Thermal conductivity ? |
0,31 W/m * K |
| Slip resistance |
Coefficient of sliding friction μ = > 0,45 (measuring
equipment:
GMG 200)
slip-inhibiting characteristic: positive (secure) |
| Chemical resistance |
- Resistant (at least 24 hours)
- to oils/ fats/ liquids/ various acids/ leaches,
- commercially available industrial floor cleaning agents |
| Usability |
The flooring can be treat upon after 24 hours, subjected to
mechanical stress after 48 hours and is completely hardened after
7 days (+ 20 °C) |
| Stability to light |
Largely resistant to light
Note: Despite the use of technically high-quality low yellow epoxy resin
materials, the effect of UV light can result in minor colour changes in the
form of slight yellowness |
| Subsurface |
Cement-bound; Surface tensile bond strength = 1,5 N/mm²,
(Subsurface moisture: < 4 % CM method);
Minimum temperature of the subsurface: > 10 °C |
Instructions for maintenance
and care |
Surface cleaning must be done depending on the conditions
ofuse. Sealing, routine cleaning and thorough cleaning conforming to the directions given by the
manufacturer in the form of projectrelated instructions for maintenance and care along with the
product and material specifications.
|
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Technical data as
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